Thermal-aware clustered microarchitectures
作者： P. Chaparro , J. Gonzalez , A. Gonzalez
DOI: 10.1109/ICCD.2004.1347897
关键词: Power density 、 Leakage (electronics) 、 Engineering 、 Superscalar 、 Automotive engineering 、 Thermal aware 、 Slowdown 、 Voltage 、 Cost reduction 、 Electronic engineering 、 Microarchitecture
摘要: As frequencies and feature size scale faster than operating voltages, power density is increasing in each processor generation. Power the cost of removing heat it generates are at same rate. Leakage significantly every process generation expected to be main source near future. Moreover, leakage grows exponentially with temperature. This paper proposes evaluates several techniques two goals: reduction average temperature order decrease power, peak reduce cooling cost. Combinations temperature-aware steering cluster hopping investigated a quad-cluster superscalar microarchitecture. Combining policy results 30% 8% expense slowdown just 5%.
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