Characterization of A Polymer-Based MEMS Packaging Technique
作者： P. Monajemi , P.J. Joseph , P.A. Kohl , F. Ayazi
DOI: 10.1109/ISAPM.2006.1666023
关键词:
摘要: This paper presents characterization of a low-cost polymer-based technique for wafer-level packaging microelectromechanical systems (MEMS). The process does not impose any size limitation to the device and can be applied wide variety MEMS devices regardless substrate type. Our utilizes thermal decomposition sacrificial polymer through overcoat cap, followed by metal deposition create hermiticity. method has been surface bulk micromachined silicon structures including resonators, tunable capacitors accelerometers. Mechanical electrical packaged is reported very close corresponding values before packaging.
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