Semiconductor Device and Method of Forming a Dual UBM Structure for Lead Free Bump Connections
作者： Stephen A. Murphy , Lin-Jen Lin , Wei Sun
DOI:
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摘要: A semiconductor device has a substrate with contact pad. first insulation layer is formed over the and under bump metallization (UBM) insulating electrically connected to second UBM. UBM after cured. The between separates portions of UBMs. photoresist an opening pad conductive material deposited within in layer. removed reflowed form spherical bump.
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