Mass spectrometry studies of resist trimming processes in HBr∕O2 and Cl2∕O2 chemistries

作者: E. Pargon , O. Joubert , T. Chevolleau , G. Cunge , Songlin Xu

DOI: 10.1116/1.1839915

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摘要: In a previous article, parametric study of HBr∕O2 and Cl2∕O2 resist trimming processes correlated to x-ray photoelectron spectroscopy (XPS) analyses has been performed. The present article confirms the preliminary results obtained by XPS. Mass spectrometry experiments have established that slow erosion rate measured in trim chemistries is attributed competitive etching atomic chlorine oxygen, while chemistries, oxygen main species, bromine playing only minor role. species originating from dissociation plasmas generates formation volatile resist-etch-by-products such as CO CO2, halogen (bromine or chlorine) less heavier CxHyBrz with CxHyClz chlorine. also shown plasma conditions leading higher concentration h...

参考文章(9)
G. Cunge, R. L. Inglebert, O. Joubert, L. Vallier, N. Sadeghi, Ion flux composition in HBr/Cl2/O2 and HBr/Cl2/O2/CF4 chemistries during silicon etching in industrial high-density plasmas Journal of Vacuum Science & Technology B. ,vol. 20, pp. 2137- 2148 ,(2002) , 10.1116/1.1511219
Harmeet Singh, John W. Coburn, David B. Graves, Mass spectrometric detection of reactive neutral species: Beam-to-background ratio Journal of Vacuum Science and Technology. ,vol. 17, pp. 2447- 2455 ,(1999) , 10.1116/1.581981
E. Pargon, O. Joubert, Songlin Xu, Thorsten Lill, Characterization of resist-trimming processes by quasi in situ x-ray photoelectron spectroscopy Journal of Vacuum Science & Technology B. ,vol. 22, pp. 1869- 1879 ,(2004) , 10.1116/1.1767038
Chian-Yuh Sin, Bing-Hung Chen, W. L. Loh, J. Yu, P. Yelehanka, A. See, L. Chan, Resist trimming in high-density CF4/O2 plasmas for sub-0.1 μm device fabrication Journal of Vacuum Science & Technology B. ,vol. 20, pp. 1974- 1981 ,(2002) , 10.1116/1.1503791
R. Foest, J. K. Olthoff, R. J. Van Brunt, E. C. Benck, J. R. Roberts, Optical and mass spectrometric investigations of ions and neutral species in SF6 radio-frequency discharges. Physical Review E. ,vol. 54, pp. 1876- 1887 ,(1996) , 10.1103/PHYSREVE.54.1876
Harmeet Singh, J. W. Coburn, David B. Graves, Appearance potential mass spectrometry: Discrimination of dissociative ionization products Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films. ,vol. 18, pp. 299- 305 ,(2000) , 10.1116/1.582183
E. Pargon, O. Joubert, N. Posseme, L. Vallier, Resist-pattern transformation studied by x-ray photoelectron spectroscopy after exposure to reactive plasmas. I. Methodology and examples Journal of Vacuum Science & Technology B. ,vol. 22, pp. 1858- 1868 ,(2004) , 10.1116/1.1767037
A. Tserepi, W. Schwarzenbach, J. Derouard, N. Sadeghi, Kinetics of F atoms and fluorocarbon radicals studied by threshold ionization mass spectrometry in a microwave CF4 plasma Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films. ,vol. 15, pp. 3120- 3126 ,(1997) , 10.1116/1.580855
Shawming Ma, Mohit Jain, J. D. Chinn, Evaluation of plasma charging damage during polysilicon gate etching process in a decoupled plasma source reactor Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films. ,vol. 16, pp. 1440- 1443 ,(1998) , 10.1116/1.581165