作者: N.R. Grove , P.A. Kohl , S.A. Bidstrup-Allen , R.A. Shick , B.L. Goodall
DOI: 10.1109/ICMCM.1997.581179
关键词:
摘要: The development of low dielectric constant materials for interlevel dielectrics is necessary to meet the demands microelectronics industry. A family derived from polynorbornene being developed as dielectrics. These are functionalized give excellent adhesion, good elongation break, and stress while maintaining their constant. In order understand effect functionalization on properties polymer, a series with different compositions investigated. these films will be used optimize cyclic polyolefin composition.