摘要: The polymer dielectrics used to fabricate multichip modules are discussed. Numerous relevant properties of the compared and contrasted. It is shown that suitability a specific material highly dependent on process chosen structure intended application module. dielectric must be taken into account when designing fabrication in order exploit advantages control disadvantages all imperfect materials bound have. >
sci-hub.se 参考文章(30)
D. R. Day, S. D. Senturia, In-Situ Monitoring of Polyamic Acid Imidization with Microdielectrometry Springer US. pp. 249- 258 ,(1984) , 10.1007/978-1-4615-7637-2_17
R. Jensen, J. Cummings, H. Vora, Copper/polyimide Materials System for High Performance Packaging IEEE Transactions on Components, Hybrids, and Manufacturing Technology. ,vol. 7, pp. 384- 393 ,(1984) , 10.1109/TCHMT.1984.1136378
C.C. Chao, K.D. Scholz, J. Leibovitz, M. Cobarruviaz, C.C. Chang, Multi-layer thin-film substrates for multi-chip packaging IEEE Transactions on Components, Hybrids, and Manufacturing Technology. ,vol. 12, pp. 180- 184 ,(1989) , 10.1109/33.31422
Naoya Yoda, H. Hiramoto, New Photosensitive High Temperature Polymers for Electronic Applications Journal of Macromolecular Science, Part A. ,vol. 21, pp. 1641- 1663 ,(1984) , 10.1080/00222338408082082
S. Herminghaus, D. Boese, D. Y. Yoon, B. A. Smith, Large anisotropy in optical properties of thin polyimide films of poly( p‐phenylene biphenyltetracarboximide) Applied Physics Letters. ,vol. 59, pp. 1043- 1045 ,(1991) , 10.1063/1.106339
L. W. Frost, I. Kesse, Spontaneous degradation of aromatic polypromellitamic acids Journal of Applied Polymer Science. ,vol. 8, pp. 1039- 1051 ,(1964) , 10.1002/APP.1964.070080302
Hayato Takasago, Kohei Adachi, Mitsuyuki Takada, A copper/polyimide metal–base packaging technology Journal of Electronic Materials. ,vol. 18, pp. 319- 326 ,(1989) , 10.1007/BF02657424
Y.-H. Kim, J. Kim, G.F. Walker, C. Feger, S.P. Kowalczyk, Adhesion and interface investigation of polyimide on metals Journal of Adhesion Science and Technology. ,vol. 2, pp. 95- 105 ,(1988) , 10.1163/156856188X00101
Shun'ichi Numata, Shuuichi Oohara, Koji Fujisaki, Jun'Ichi Imaizumi, Noriyuki Kinjo, Thermal expansion behavior of various aromatic polyimides Journal of Applied Polymer Science. ,vol. 31, pp. 101- 110 ,(1986) , 10.1002/APP.1986.070310110
David Burdeaux, Paul Townsend, Joseph Carr, Philip Garrou, Benzocyclobutene (BCB) dielectrics for the fabrication of high density, thin film multichip modules Journal of Electronic Materials. ,vol. 19, pp. 1357- 1366 ,(1991) , 10.1007/BF02662825