Integrated circuit and method for fabricating the same
作者： Mou-Shiung Lin , Jin-Yuan Lee
DOI:
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摘要: A method for fabricating an integrated circuit (IC) chip includes forming a metal trace having thickness of between 5 μm and 27 over semiconductor substrate, passivation layer on the trace, wherein silicon nitride oxide nitride, or oxynitride oxynitride.
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