Thermal assembly of polysilicon microactuators with narrow-gap electrostatic comb drive
作者： G.K. Fedder , J.C. Chang , R.T. Howe
DOI: 10.1109/SOLSEN.1992.228275
关键词:
摘要: Surface micromachined, polysilicon fuse and weld microstructures are modeled, fabricated, characterized. The current required to cut the thin, 2000 AA is 30 mA, compared 80 mA for a 2 mu m-thick fuse. For large currents, simple model shows that time inversely proportional square of current. An aluminum microbridge used form robust weld, connecting two structures. surface tension molten Al produces force approximately 15 M, which about 100 times larger than electrostatic comb drive forces. A series pulses melt without destroying joint. >
sci-hub.se 参考文章(10)
K.S.J. Pister, Hinged polysilicon structures with integrated CMOS TFTs Technical Digest IEEE Solid-State Sensor and Actuator Workshop. pp. 136- 139 ,(1992) , 10.1109/SOLSEN.1992.228307
Y.C. Tai, R.S. Muller, Fracture strain of LPCVD polysilicon IEEE Technical Digest on Solid-State Sensor and Actuator Workshop. pp. 88- 91 ,(1988) , 10.1109/SOLSEN.1988.26440
P. Krulevitch, Tai D. Nguyen, G. C. Johnson, R. T. Howe, H. R. Wenk, R. Gronsky, Lpcvd Polycrystalline Silicon Thin Films: The Evolution of Structure, Texture and Stress MRS Proceedings. ,vol. 202, pp. 167- ,(1990) , 10.1557/PROC-202-167
M. E. Lunnon, D. W. Greve, The microstructure of programmed n+pn+ polycrystalline silicon antifuses Journal of Applied Physics. ,vol. 54, pp. 3278- 3281 ,(1983) , 10.1063/1.332438
YC Tai, CH Mastrangelo, RS Muller, None, Thermal conductivity of heavily doped low‐pressure chemical vapor deposited polycrystalline silicon films Journal of Applied Physics. ,vol. 63, pp. 1442- 1447 ,(1988) , 10.1063/1.339924
T. Hirano, T. Furuhata, K.J. Gabriel, H. Fujita, Operation of sub-micron gap electrostatic comb-drive actuators TRANSDUCERS '91: 1991 International Conference on Solid-State Sensors and Actuators. Digest of Technical Papers. pp. 873- 876 ,(1991) , 10.1109/SENSOR.1991.149025
R.L. Alley, G.J. Cuan, R.T. Howe, K. Komvopoulos, The effect of release-etch processing on surface microstructure stiction Technical Digest IEEE Solid-State Sensor and Actuator Workshop. pp. 202- 207 ,(1992) , 10.1109/SOLSEN.1992.228292
Weijie Yun, R.T. Howe, P.R. Gray, Surface micromachined, digitally force-balanced accelerometer with integrated CMOS detection circuitry Technical Digest IEEE Solid-State Sensor and Actuator Workshop. pp. 126- 131 ,(1992) , 10.1109/SOLSEN.1992.228309
W.C. Tang, T.-C.H. Nguyen, R.T. Howe, Laterally driven polysilicon resonant microstructures international conference on micro electro mechanical systems. pp. 53- 59 ,(1989) , 10.1109/MEMSYS.1989.77961
G.K. Fedder, R.T. Howe, Thermal assembly of polysilicon microstructures international conference on micro electro mechanical systems. pp. 63- 68 ,(1991) , 10.1109/MEMSYS.1991.114770