作者: P. Krulevitch , Tai D. Nguyen , G. C. Johnson , R. T. Howe , H. R. Wenk
DOI: 10.1557/PROC-202-167
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摘要: An investigation of undoped LPCVD polycrystalline silicon films deposited at temperatures ranging from 605 to 700 C and silane pressures 300 550 mTorr revealed large variations in stress with processing conditions a correlation between texture. TEM HRTEM analysis show that morphology differences also exist. At lower (≈605 C) higher (≈400 mTorr), the appear deposit an amorphous state crystallize during deposition form microstructures characterized by equi-axed grains, tensile residual stress, texture {110} {11/} (/=2 or 3) components. Higher (between 620 650 produce nucleate Si02 interface, creating oriented columnar microstructure. C, grains are still columnar, but dominant is {100}. Films greater than exhibit compressive some contain regions hexagonal silicon. This paper proposes possible causes varying stresses, textures, films.