Trench-filling etch-masking microfabrication technique
作者： Liang-Yuh Chen , Xiaojun Trent Huang , Noel C. MacDonald
DOI:
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摘要: A process is described for manufacturing submicron, ultra-high aspect ratio microstructures using a trench-filling etch masking technique. Deep trenches are etched into substrate, the filled with an appropriate material, and deep etching substrate carried out material serving as mask.
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