作者: V. P. Popov , A. K. Gutakovskii , L. N. Safronov , I. E. Tyschenko , S. K. Zhuravlev
DOI: 10.1007/978-94-010-0339-1_21
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摘要: In the fundamental phenomenon of blistering observed during implantation gas ions into silicon, there remains a long-standing controversy concerning mechanism decay over-saturated solid solution atoms and intrinsic point defects. The interest to this has been drastically renewed in recent years due its practical significance since adds toolbox SOI technology useful method known as “Smart Cut” [1].