A Study on Wafer Level Vacuum Packaging for MEMS Devices
作者： Kukjin Chun , Seonho Seok , Chihwan Jeong , Byeungleul Lee
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摘要: An ew vacuum packaging process at the wafer level is developed for surface micromachining devices using glass–silicon anodic bonding technology. The rim which needed to prevent leakage built up simultaneously as structure being etched. mechanical resonator used a tool evaluating of packaging. inside pressure packaged device wa sm easured indirectly by measuring quality factor resonator. measured Q was about 5 × 10 4 and estimated inner 1 mTorr. It also possible change from 2 Torr mTorr varying amount Ti getter material. yield 80% degradation not observed after 1000 h had passed. applied resonant accelerometers need high environment implement higher performance. (Some figures in this article are colour only electronic version)
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