Anisotropic etching of silicon crystals in KOH solution: Part III Experimental and theoretical shapes for 3D structures micro-machined in (hk0) plates

摘要: The micro-machining of various (h k 0) silicon plates in an aqueous KOH solution was studied. Orientation effects, the formation limiting facets and concave or convex undercuttings have been analysed for membranes mesa obtained starting with circular masks. Procedures derived to predict 3D etching shapes using a tensorial model chemical etching. Predicted found closely agree experimental because important role played by {1 1 1} facets. Theoretical general etched were also crude accord experiments. Consequently some attempts made identify h l) planes which can participate undercutting discuss dissolution slowness surface.