Process for fabrication of 3-dimensional micromechanisms

摘要: This invention provides a fabrication process for manufacturing of truly 3-dimensional micromechanisms which takes advantages SOI (silicon-on-insulator) wafers each is processed to create respective structural element the by DRIE (deep reactive ion etching) wafer and thermal oxidation trenches opened during etching. The are sequentially bonded into multistack structure from 3-D micromechanism released XeF2 Thermally grown SiO2 used as material micromechanism.