Failing Frequency Signature Analysis
作者： Jaekwang Lee , Edward J. McCluskey
DOI: 10.1109/TEST.2008.4700561
关键词:
摘要: A failing frequency signature is a collection of the maximum operating frequencies each pattern in set. Analyzing can successfully detect small-delay defects, because even defect cause an outlier to appear signature. Moreover, will be consistent presence process variations. Failing analysis effectively very hard-to-find defects that occur No-Trouble-Found (NTF) devices, without necessity thorough test patterns. The also used for characterization tests. In this paper, experimental results using are presented chips fabricated 0.18 mum technology.
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