Random and systematic defect analysis using IDDQ signature analysis for understanding fails and guiding test decisions

作者: P. Nigh , A. Gattiker

DOI: 10.1109/TEST.2004.1386966

关键词:

摘要: This work demonstrates IDDQ signature analysis of random and systematic defects, including yield detractors reliability defects. Application is demonstrated for both understanding failure root cause guiding test decisions. signatures contain rich information about the circuit, defect behavior processing conditions. paper describes capturing that by classifying into different categories using classifications to learn nature defects occuring on a variety ASIC chips.

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