In situ characterization of titanium silicide formation: The effect of Mo interlayer, temperature ramp-rate, and annealing atmosphere

作者: S.-L. Zhang , C. Lavoie , C. Cabral , J. M. E. Harper , F. M. d’Heurle

DOI: 10.1063/1.369626

关键词:

摘要: The formation of titanium silicides has been studied using simultaneous in situ x-ray diffraction with millisecond time resolution and sheet resistance measurements. effect a Mo interposed layer between Ti films Si substrate was investigated by varying the thickness interlayer from 0 (Ti/Si) to 1.8 nm (Ti/Mo/Si). kept 55 for all samples. Both isothermal annealing ramp helium were performed order study mechanism silicide formation. While C49 TiSi2 only disilicide found after Ti/Si at 650 °C 20 min, C54 readily formed presence Mo. not observed thick interlayer. Instead, there indication that C40 (Mo,Ti)Si2 formed. In addition, broad peaks, weak intensity, could be assigned Ti5Si4. However, Ti5Si4 alone did induce TiSi2. Even 20 °C increase annealing...

参考文章(27)
G. B. Stephenson, K. F. Ludwig, J. L. Jordan‐Sweet, S. Brauer, J. Mainville, Y. S. Yang, M. Sutton, Instrumentation for millisecond‐resolution scattering studies (invited) Review of Scientific Instruments. ,vol. 60, pp. 1537- 1540 ,(1989) , 10.1063/1.1141031
Shin‐ichi Ogawa, Takashi Kouzaki, Takehito Yoshida, Robert Sinclair, Interface microstructure of titanium thin‐film/silicon single‐crystal substrate correlated with electrical barrier heights Journal of Applied Physics. ,vol. 70, pp. 827- 832 ,(1991) , 10.1063/1.349641
J.B. Lasky, J.S. Nakos, O.J. Cain, P.J. Geiss, Comparison of transformation to low-resistivity phase and agglomeration of TiSi/sub 2/ and CoSi/sub 2/ IEEE Transactions on Electron Devices. ,vol. 38, pp. 262- 269 ,(1991) , 10.1109/16.69904
Robert Beyers, Robert Sinclair, Metastable phase formation in titanium‐silicon thin films Journal of Applied Physics. ,vol. 57, pp. 5240- 5245 ,(1985) , 10.1063/1.335263
F. Chu, Ming Lei, S.A. Maloy, J.J. Petrovic, T.E. Mitchell, Elastic properties of C40 transition metal disilicides Acta Materialia. ,vol. 44, pp. 3035- 3048 ,(1996) , 10.1016/1359-6454(95)00442-4
A. Mouroux, S.-L. Zhang, C. S. Petersson, Enhancement of the formation of the C54 phase of TiSi 2 through the introduction of an interposed layer of tantalum Physical Review B. ,vol. 56, pp. 10614- 10620 ,(1997) , 10.1103/PHYSREVB.56.10614
S.-L. Zhang, F.M. d'Heurle, Stresses from solid state reactions: a simple model, silicides Thin Solid Films. ,vol. 213, pp. 34- 39 ,(1992) , 10.1016/0040-6090(92)90471-M
R. W. Mann, G. L. Miles, T. A. Knotts, D. W. Rakowski, L. A. Clevenger, J. M. E. Harper, F. M. D’Heurle, C. Cabral, Reduction of the C54–TiSi2 phase transformation temperature using refractory metal ion implantation Applied Physics Letters. ,vol. 67, pp. 3729- 3731 ,(1995) , 10.1063/1.115364
V. Svilan, K. P. Rodbell, L. A. Clevenger, C. Cabral, R. A. Roy, C. Lavoie, J. Jordan-Sweet, J. M. E. Harper, Dependence of Crystallographic Texture of C54 Tisi 2 on Thickness and Linewidth In Submicron Cmos Structures MRS Proceedings. ,vol. 427, pp. 53- ,(1996) , 10.1557/PROC-427-53
L.A Clevenger, C Cabral, R.A Roy, C Lavoie, J Jordan-Sweet, S Brauer, G Morales, K.F Ludwig, G.B Stephenson, Formation of a crystalline metal-rich silicide in thin film titanium/silicon reactions Thin Solid Films. ,vol. 289, pp. 220- 226 ,(1996) , 10.1016/S0040-6090(96)08787-1