作者: Shari Elizabeth Koval , Bruce Gardiner Aitken , Mark Alejandro Quesada
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摘要: A method for hermetically sealing a device without performing heat treatment step and the resulting sealed are described herein. The includes steps of: (1) positioning un-encapsulated in desired location with respect to deposition device; (2) using deposit material over at least portion of form having perform post-deposition treating step. For instance, can be Sn 2+ -containing inorganic oxide or low liquidus temperature material.