作者: Chang-Jae Kim
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摘要: The present invention relates to a temperature controllable gas distributor which includes cover having first passage between its upper and lower cover, second embedded along an edge portion of the heater installed in passage, support welded around distributing plate fixed at portion. plurality nozzles, third is fluid formed interior 201 . Second heaters are passage. In distribution apparatus according invention, since it possible control plate, namely, entire portions contacting with gas, abnormal reaction liquefaction source can be prevented. Therefore, when depositing thin film on wafer using apparatus, prevent pollution occurs due particles film, uniform deposition thickness faster speed obtained. As result, reliability semiconductor device enhanced, fabrication time decreased for thereby decreasing cost.