Piezoresistive n-type 4H-SiC pressure sensor with membrane formed by mechanical milling

作者: Terunobu Akiyama , Danick Briand , Nico F. de Rooij

DOI: 10.1109/ICSENS.2011.6126936

关键词:

摘要: A 4H-SiC pressure sensor with piezoresistive transducers, for harsh environment applications, e.g., high temperature (∼650°C) and/or in corrosive chemicals is presented. The sensing membrane, 1 mm diameter and 50 µm thickness, was formed by milling (drilling) a bulk single crystal SiC wafer. Both transverse longitudinal piezoresistors were on the membrane out of an n-type epitaxial layer. Ohmic contacts obtained Ta/Ni/Pt metallization followed annealing at 1000°C 20 min. assembled small board characterized under hydrostatic pressures up to 60 bar room temperature. sensitivity 268 µV/V/bar. chip exposed air 600°C 165 hours changes bridge resistance measured.

参考文章(8)
A.A. Ned, R.S. Okojie, A.D. Kurtz, 6H-SiC pressure sensor operation at 600/spl deg/C 1998 Fourth International High Temperature Electronics Conference. HITEC (Cat. No.98EX145). pp. 257- 260 ,(1998) , 10.1109/HITEC.1998.676799
Joseph S. Shor, Anthony D. Kurtz, Photoelectrochemical Etching of 6 H ‐ SiC Journal of The Electrochemical Society. ,vol. 141, pp. 778- 781 ,(1994) , 10.1149/1.2054810
J. Zhang, K. Sugioka, S. Wada, H. Tashiro, K. Toyoda, K. Midorikawa, Precise microfabrication of wide band gap semiconductors (SiC and GaN) by VUV–UV multiwavelength laser ablation Applied Surface Science. ,vol. 127, pp. 793- 799 ,(1998) , 10.1016/S0169-4332(97)00744-7
David C. Sheridan, Jeff B. Casady, C.E. Ellis, R.R. Siergiej, J.D. Cressler, R.M. Strong, W.M. Urban, W.F. Valek, C.F. Seiler, H. Buhay, Demonstration of Deep (80μm) RIE Etching of SiC for MEMS and MMIC Applications Materials Science Forum. pp. 1053- 1056 ,(2000) , 10.4028/WWW.SCIENTIFIC.NET/MSF.338-342.1053
R.S. Okojie, E. Savrun, Phong Nguyen, Vu Nguyen, C. Blaha, Reliability evaluation of direct chip attached silicon carbide pressure transducers ieee sensors. pp. 635- 638 ,(2004) , 10.1109/ICSENS.2004.1426246
Glenn Beheim, Carl S. Salupo, Deep RIE Process for Silicon Carbide Power Electronics and MEMS MRS Proceedings. ,vol. 622, pp. 891- 896 ,(2000) , 10.1557/PROC-622-T8.9.1
G. Wieczorek, B. Schellin, E. Obermeier, G. Fagnani, L. Drera, SiC Based Pressure Sensor for High-Temperature Environments ieee sensors. pp. 748- 751 ,(2007) , 10.1109/ICSENS.2007.4388508
Robert S Okojie, Dorothy Lukco, Charles Blaha, Vu Nguyen, Ender Savrun, Zero offset drift suppression in SiC pressure sensors at 600 °C ieee sensors. pp. 2269- 2274 ,(2010) , 10.1109/ICSENS.2010.5690714