作者: N. Tokura , S. Takahashi , K. Hara
DOI: 10.1109/ISPSD.1993.297124
关键词:
摘要: A novel process/device technology for a low on-resistance power MOSFET, namely, DMOS consisting of channel region defined by LOCOS (LOCOS-DMOS), is described. The vertical structure formed not the trench etching technique, but combination local oxidation silicon (LOCOS) and diffusion self-alignment (DSA) using oxide film as double mask. results modeling 12- mu m microcell two-dimensional numerical simulations indicate an approximately 40% improvement in compared with conventional planar-DMOS under same conditions cell pitch 50-V blocking voltage. formation hollow verified process simulation. LOCOS-DMOS promises great loss MOSFETs operated high-power switching. >