作者: M.-H. Cho , Y. S. Roh , C. N. Whang , K. Jeong , S. W. Nahm
DOI: 10.1063/1.1487923
关键词:
摘要: The thermal stability and structural characteristics for gate stack structure of HfO2 dielectrics deposited by atomic-layer deposition (ALD) were investigated. chemical state the films in relation to film thickness postannealing temperature examined x-ray diffraction photoelectron spectroscopy. An interfacial layer hafnium silicate with an amorphous was grown on oxidized Si substrate at initial growth stage. are closely affected depended films. 45 A thick changed into a polycrystalline after rapid annealing 750 °C 5 min, while thicker monoclinic or tetragonal crystal structure. region is not stable even 700 °C under ultrahigh vacuum condition...