Process for forming a circuit assembly
作者： Willi Volksen , Richard A. DiPietro , John P. Hummel , Robert D. Miller , James L. Hedrick
DOI:
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摘要: The invention relates to a process for forming circuit assembly comprising (i) coating onto substrate layer of polyamic ester selected from unique class esters; (ii) imidizing the form polyimide having an even surface and (iii) conductors on polyimide.
google.nl 参考文章(6)
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