作者: Minoru Ueki , Sumio Ogawa , Shinichi Hara
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摘要: A semiconductor device manufacturing system is provided in which chip position information read without removing resin from a package so that the cause of failure can be quickly identified and removed yield chips rapidly improved. replacement address reading reads redundancy addresses determined as faulty test performed after has been sealed into package. analyzing estimates, combination these addresses, lot number, wafer number device. distribution mapping maps each based on numbers thus obtained. determining identifies or processing step caused failures process above distribution.