Precision removal of ITO layer using plate-form tool design

摘要: An ITO layer is produced using semiconductor techniques, although the defect rate during production easily seen. Current work presents a new modus of electrochemical machining ‘design recycle’ system offering faster performance in removing color filter surface’s layer. Higher electrical current not required when an effective feeding electrode used to reduce response area. Through establishing ultra-precise recycling process remove thin film microstructure, this helps optoelectronic industry both costs and pollution. The design features removal processes for tool plate-form are major interest. In experiment, author utilizes 5th Generation TFT-LCD. electrodes with continuous pulsed direct experiment. High rotational speed high flow velocity electrolyte elevates discharge mobility improves effect. Pulsed can improve effect dregs advantageous associate fast feed workpiece. A combined enough electric power provide highly removal. smaller end radius positive-electrode larger space better precision presented machining. It only needs short period time cleanly.