Semiconductor device with vias on a bridge connecting two buses
作者： Douglas M. Reber , Mehul D. Shroff , Edward O. Travis
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摘要: A semiconductor device comprises conductive buses and bridges. respective bridge is conductively coupled to at least two portions of one the buses. At N plus (N+1) vias are between every bridges a feature in an integrated circuit when: (1) width less than each which coupled, (2) distance along critical distance. number couplings
lens.org 参考文章(11)
Miles F. McCoo, Naresh K. Sehgal, Artour Levin, Kiran Ganesh, 2-dimensional placement with reliability constraints for VLSI design ,(1999)
Vivian W. Ryan, Stress migration evaluation method ,(1997)
Peter Borgesen, Matt A. Korhonen, Che-Yu Li, Interconnect structures containing blocked segments to minimize stress migration and electromigration damage ,(1994)
Ernest Levine, Jawahar Nayak, Hazara Rathore, Michael Lane, John McGrath, Vincent McGahay, Conrad Barile, Du Nguyen, Xiao Liu, Hormazdyar Dalal, Birendra Agarwala, Thomas Shaw, Brett Engel, Conal Murray, Stacked via-stud with improved reliability in copper metallurgy ,(2002)
Fangyi Luo, Yongbo Jia, Wayne Wei-Ming Dai, Yield-preferred via insertion based on novel geotopological technology Proceedings of the 2006 conference on Asia South Pacific design automation - ASP-DAC '06. pp. 730- 735 ,(2006) , 10.1145/1118299.1118469
E.T. Ogawa, J.W. McPherson, J.A. Rosal, K.J. Dickerson, T.-C. Chiu, L.Y. Tsung, M.K. Jain, T.D. Bonifield, J.C. Ondrusek, W.R. McKee, Stress-induced voiding under vias connected to wide Cu metal leads international reliability physics symposium. pp. 312- 321 ,(2002) , 10.1109/RELPHY.2002.996654
T.C. Huang, C.H. Yao, W.K. Wan, C.C. Hsia, M.S. Liang, Numerical modeling and characterization of the stress migration behaviour upon various 90 nanometer Cu/Low k interconnects international interconnect technology conference. pp. 207- 209 ,(2003) , 10.1109/IITC.2003.1219755
Hidetoshi Matsuoka, Design support method, design support apparatus, computer product ,(2007)
David G. Wontor, Scott K. Pozder, Brett P. Wilkerson, Kevin J. Hess, Jie-Hua Zhao, Edward O. Travis, Pak K. Leung, Integrated circuit having structural support for a flip-chip interconnect pad and method therefor ,(2005)