Free-acid containing polymers and their use in photoresists

作者: Ilya Rushkin , Art Medina , Sanjay Malik , Gregory Spaziano , David Brzozowy

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摘要: An improved binder resist for use in radiation sensitve photoresist compositions comprises a polymer having monomeric units of (a) carboxylic anhydride units, (b) alkenyl silane and (c) containing an acid labile group, wherein the contains from about 1 to 3 mol % free is provided either by presence futher unit acids groups or hydrolysis sufficient unit.

参考文章(13)
John Joseph Biafore, Patrick Foster, Gregory Domenic Spaziano, Radiation sensitive copolymers, photoresist compositions thereof and deep uv bilayer systems thereof ,(2000)
Atsushi Sawano, Hidekatsu Kohara, Kousuke Doi, Taeko Ikegawa, Tsuyoshi Nakamura, Novel copolymer, photoresist composition, and process for forming resist pattern with high aspect ratio ,(2003)
Takaaki Negishi, Hirotoshi Fujie, Keiji Oono, Fumiyoshi Urano, Resist material and pattern formation process ,(1992)
Gregory M. Wallraff, Richard A. DiPietro, Robert D. Allen, Photoresist composition with androstane and process for its use ,(1994)
Thomas Steinhausler, John Joseph Biafore, Patrick Foster, Sidney Georges Slater, Andrew J. Blakeney, Hydroxy-amino thermally cured undercoat for 193 nm lithography ,(2000)
Karen Elizabeth Petrillo, David Earle Seeger, Edward Darko Babich, John Patrick Simons, Photoresist having increased sensitivity and use thereof ,(1996)
Ronald James Hoxmeier, Robert Charles Job, Bridget Ann Spence, Donn Anthony Dubois, A process for making graft block copolymers by growing anionic polymer chains from functionalized polyolefin backbones ,(1996)
Thomas Steinhausler, John Joseph Biafore, Sydney George Slater, Patrick Foster, Andrew J. Blakeney, Hydroxy-diisocyanate thermally cured undercoat for 193 nm lithography ,(1999)
Horst Borndoerfer, Siegfried Birkle, Hellmut Ahne, Rainer Leuschner, Michael Sebald, Recai Sezi, Photoresists which are suitable for producing sub-micron size structures ,(1995)