Rare earth metal surface-activated plasma doping on semiconductor substrates

作者: Reza Arghavani , Yunsang Kim

DOI:

关键词:

摘要: Methods of doping semiconductor substrates using deposition a rare earth metal-containing film such as an yttrium-containing film, and annealing techniques are provided herein. Rare films deposited gas, liquid, or solid precursors without bias may be conformally. Some embodiments involve plasma. Substrates annealed at temperatures less than about 500° C.

参考文章(13)
Xing Zhang, Yue Guo, Zhiqiang Li, Xia An, Ru Huang, Ge-based nmos device and method for fabricating the same ,(2012)
Sung-min Kim, Eun-Jung Yun, Dong-won Kim, Schottky barrier FinFET device and fabrication method thereof ,(2006)
Brian S. Doyle, David B. Fraser, Peng Cheng, Gang Bai, Chunlin Liang, High dielectric constant metal oxide gate dielectrics ,(2002)
Moon-Gyu Jang, Yark-Yeon Kim, Tae-Youb Kim, Myung-Sim Jun, Byoung-Chul Park, Seong-Jae Lee, Chel-jong Choi, Method for fabricating Schottky barrier tunnel transistor ,(2007)
Stanislav Ivanovich Soloviev, Zachary Matthew Stum, Greg Thomas Dunne, Jesse Berkley Tucker, Method for doping impurities ,(2006)
Robert S. Chau, Gilbert Dewey, Niloy Mukherjee, Matt Metz, Jack Kavalieros, Methods of forming low interface resistance rare earth metal contacts and structures formed thereby ,(2008)
Brian S. Doyle, Gilbert Dewey, Niloy Mukherjee, Dinesh Somasekhar, Jack T. Kavalieros, Embedded memory cell and method of manufacturing same ,(2009)
Reza Arghavani, Benjamin A. Bonner, Jeffrey Marks, Cvd based metal/semiconductor ohmic contact for high volume manufacturing applications ,(2013)