Probe apparatus for testing multiple integrated circuit dies

摘要: There is provided a probe apparatus with stage for holding wafer on which plurality of chips are regularly arranged such that the substantially in an XY plane, large number contactors facing held stage, to corresponding respective pads as be brought into contact collectively all device circuits wafer, tester transmitting/receiving test signal to/from via contactors, elevator elevating Z-axis direction, alignment moving X-axis and/or Y-axis and controller controlling device.