Electronic device using group iii nitride semiconductor and its fabrication method and an epitaxial multi-layer wafer for making it

作者: Tadao Hashimoto

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摘要: The present invention discloses an electronic device using a group III nitride substrate fabricated via the ammonothermal method. By utilizing high-electron concentration of ammonothermally grown substrates having dislocation density less than 10 5 cm −2 , combined with high-purity active layer Ga 1-x-y Al x In y N (0≦x≦1, 0≦y≦1) by vapor phase method, can attain high level breakdown voltage as well low on-resistance. To realize good matching between and layer, transition is optionally introduced. thicker depletion region created structure in layer.

参考文章(27)
Timothy J. Bettles, Robert T. Bondokov, Kenneth E. Morgan, Joseph A. Smart, Shiwen Liu, Glen A. Slack, Leo J. Schowalter, Nitride semiconductor heterostructures and related methods ,(2007)
Siddha Pimputkar, Shuji Nakamura, James S. Speck, Derrick S. Kamber, Using boron-containing compounds, gasses and fluids during ammonothermal growth of group-iii nitride crystals ,(2009)
Peter Micah Sandvik, Kristi Jean Narang, Huicong Hong, Stephen Daley Arthur, Mark Philip D'Evelyn, Larry Burton Rowland, Dong-Sil Park, Steven Francis LeBoeuf, Gallium nitride crystals and wafers and method of making ,(2006)
Jerzy Garczyński, Robert Dwiliński, Yasuo Kanbara, Leszek P. Sierzputowski, Roman Doradziński, Bulk nitride mono-crystal including substrate for epitaxy ,(2006)