作者: C.R Hutchinson , R.E Hackenberg , G.J Shiflet
DOI: 10.1016/S0304-3991(02)00193-6
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摘要: Abstract This paper reports the results of a fine-probe EDS microanalytical study cellular precipitation in Cu–Ti binary alloy. Compositional profiles across solute depleted Cu-rich FCC lamellae and Cu 4 Ti within isothermally formed colonies were measured FEG-TEM from thin-foil specimens prepared by conventional electropolishing technique using Ga + focused ion-beam (FIB). The Cliff–Lorimer ratio method, with an absorption correction, was employed to quantify compositions. Two FIB samples different orientations respect ion-milling direction. compositional compound both FIB-prepared electropolished sample were, experimental error, numerically equivalent. composition phase very close ideal stoichiometric 20 at% Ti. It is concluded that for this system, specimen preparation procedures used study, process has had no detectable effect on chemistry changes interlamellar interface at scale studied. These indicate possible sources chemical artifacts which include redeposition, preferential sputtering ion-induced atomic migration can be minimized if several precautions are taken during milling FIB. Consistent previous investigators, it also found does introduce significant structural (e.g., dislocations) into softer compared produced electropolishing.