Chemical‐Mechanical Polishing for Fabricating Patterned W Metal Features as Chip Interconnects
作者： F. B. Kaufman , D. B. Thompson , R. E. Broadie , M. A. Jaso , W. L. Guthrie
DOI: 10.1149/1.2085434
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摘要: … 7) shows clear evidence for the planarity of the process and indicates that the W seams, unavoidable with a conformal CVD deposition process, have not been degraded by process …
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