作者: Christopher F. Bevis , Ian Robert Smith
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摘要: An electrical test method and apparatus are disclosed. In the one or more ring oscillators formed in layers prior to formation of a metal 1 layer semiconductor wafer. The comprise formulation transistors local interconnects. One structures interconnect at after Each structure is coupled corresponding oscillators. A voltage applied non-precision contacts cause oscillate. At-speed performance determined from measured signals obtained structures. includes comprising interconnects wafer contact for applying