Measuring thermal substrate resistance and impact on the characterization of thermoelectric modules

作者: Reginald D. Pierce , Robert J. Stevens

DOI: 10.1016/J.MEASUREMENT.2017.07.015

关键词:

摘要: Abstract Different characterization methods for measuring Seebeck, electrical resistance, thermal conductance, and ZT of thermoelectrics modules power generation applications found in literature have produced different results. These differences exist even when the use same module on test equipment using temperatures across module. We develop a model that accounts resistance substrate contact do simulations to show by accounting observed experimental can be accounted for. Based model, we two new approaches determining provide means properly interpreting results from four common thermoelectric methods. apply correction data demonstrate consistent measured parameters regardless testing approach used.

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