Mesa release and deposition used for GaAs-on-Si MESFET fabrication

作者: J. de Boeck , G. Zou , M. van Rossum , G. Borghs

DOI: 10.1049/EL:19910015

关键词: MesaOptoelectronicsSiliconDeposition (law)Semiconductor device fabricationFabricationMESFETGallium arsenideField-effect transistorMaterials science

摘要: A report is made on the first devices processed using a novel mesa release and deposition (MRD) technique hetero-epitaxial GaAs-on-Si. Mesas are etched, released by under-etching deposited selfaligned their original positions. Standard MESFET processing performed MRD structures, demonstrating suitability of for fabrication monolithic optoelectronic GaAs Si

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