Method and device for determining the temperature calibration characteristic curve of a semiconductor component appertaining to power electronics

摘要: The invention relates to methods and devices for determining the temperature calibration characteristic curve of a semiconductor component (3) appertaining power electronics. They are distinguished, in particular, by fact that can be determined simple economically advantageous manner. For this purpose, connections interconnected—with first current source (1) load current,—with second (2) measurement Current—with voltmeter (v) measuring voltage dropped across either or auxiliary connected connections. Furthermore, data processing system is—heated means loss thereof at intervals with switched on and—the off is measured between after time duration thermal main constant as values representing including associated temperatures. Following an approximation form (3).