Nanosecond excimer laser-enhanced chemical etching

摘要: Abstract The use of lasers in etching and deposition processes has been studied extensively, especially during the last decade. Progress understanding mechanisms pulsed laser-enhanced chemical is largely recent data. An overview given discussed. Experimental results excimer copper silicon a low-pressure chlorine environment are emphasized. In particular measured detection angle time-of-flight distributions Calculations effects post-desorption collisions between etch products on measurement kinetic energy presented used to explain experimental results. It shown that both laser-driven diffusion into dependence behaviour surface coverage which have be taken account description mechanism.