Apparatus for and method of processing substrate

作者: Atsushi Osawa , Yoshitaka Abiko

DOI:

关键词:

摘要: A substrate processing apparatus discharges a hydrofluoric acid solution from discharge nozzles toward grooves formed in side walls of an inner bath. The discharged the impinges upon to diffuse, thereby moving top portion bath form low-speed uniform liquid flows. Thus, metal component and foreign substances generated float up without being agitated within bath, are rapidly drained outer together with solution.

参考文章(16)
In-Gi Kim, Dae-hyuk Kang, Dae-hyuk Chung, Apparatus and method of etching a semiconductor substrate ,(2007)
Kenji Yokomizo, Tom Williams, Etching method and etching apparatus ,(1999)
Nakazawa Makoto, Yuasa Satoshi, Matsumura Yoshitaka, SUBSTRATE TREATING DEVICE ,(1993)
Kazuhisa Ogasawara, Munenori Kawate, Yoshihiro Haruki, Yoshiaki Sakaihara, Katsuyoshi Nakamu, 勝吉 中務, 和久 小笠原, 宗則 川手, 佳弘 春木, 義晶 堺原, Method and device for substrate processing ,(2003)
Maeda Tokuo, Ono Masao, Ki Kannan, Washimi Koji, Matsumoto Takao, Sato Yoshikazu, SUBSTRATE TREATING EQUIPMENT ,(2001)
弘明 高橋, Hiroaki Takahashi, Method and apparatus for processing substrate ,(2005)
Numakura Masahiro, SUBSTRATE PROCESSING APPARATUS ,(2003)
Tokuri Kentarou, SUBSTRATE TREATMENT SYSTEM ,(1997)