Implanted hidden interconnections in a semiconductor device for preventing reverse engineering

作者: James P. Baukus , Lap-Wai Chow , William M. Clark

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摘要: A camouflaged interconnection for interconnecting two spaced-apart implanted regions of a common conductivity type in an integrated circuit or device and method forming same. The comprises first region conducting channel between the regions, being same bridging second opposite to type, disposed over lying camouflage from reverse engineering.

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