Novel air gap integration scheme
作者： Derek R. Witty , Li-Qun Xia , Hichem M'Saad , Alexandros T. Demos , Bok Hoen Kim
DOI:
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摘要: Methods are provided for forming a structure that includes an air gap. In one embodiment, method is damascene comprises depositing porous low dielectric constant layer by including reacting organosilicon compound and porogen-providing precursor, porogen-containing material, removing at least portion of the organic on feature definition in layer, filing with conductive material therein, mask disposed definition, apertures to expose or all through apertures, gap adjacent material.
lens.org 参考文章(39)
Simon Chooi, Mei-Sheng Zhou, Method for forming an air gap as low dielectric constant material using buckminsterfullerene as a porogen in an air bridge or a sacrificial layer ,(2000)
Toshiaki Hasegawa, Hajime Nakayama, Semiconductor device having low dielectric layer and method of manufacturing thereof ,(2001)
Khaled A. Elsheref, Derek R. Witty, Zhenjiang Cui, Lester A. D'Cruz, Francimar Schmitt, Sang H. Ahn, Alexandros T. Demos, Hichem M'Sadd, Techniques promoting adhesion of porous low K film to underlying barrier layer ,(2005)
Darryl D. Restaino, Sarah L. Lane, Takeshi Nogami, Jia Lee, Son V. Nguyen, Kensaku Ida, Advanced low dielectric constant organosilicon plasma chemical vapor deposition films ,(2006)
Derek R. Witty, Martin Jay Seamons, Michael Chiu Kwan, Rongping Wang, Kee Bum Jung, Li-Qun Xia, Lihua Li Huang, Hichem M'saad, Mihaela Balseanu, Lewis Stern, Tensile and compressive stressed materials for semiconductors ,(2005)
Robert H. Havemann, Shin-puu Jeng, Multilevel interconnect structure with air gaps formed between metal leads ,(1994)
Sofiane Soukane, Jeffrey D. Chinn, Etch process for etching microstructures ,(2002)
Xiaoye Zhao, Yan Ye, Hong Du, Method of fabricating a dual damascene interconnect structure ,(2006)
Carlo Waldfried, Orlando Escorcia, Ivan Berry, Ultraviolet assisted pore sealing of porous low k dielectric films ,(2004)
Deborah A. Neumayer, Alfred Grill, Stephen McConnell Gates, Son Van Nguyen, Ultra low k plasma enhanced chemical vapor deposition processes using a single bifunctional precursor containing both a SiCOH matrix functionality and organic porogen functionality ,(2004)