Method of avoiding ampoule adhesion of ingots in Bridgman growth of CuInSe2
作者： L.S. Yip , I. Shih , C.H. Champness
DOI: 10.1016/0022-0248(93)90438-3
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摘要: … the melt and the molybdenum or titanium during the experiments. … of titanium wire showed no sign of adhesion between the ingot … ingots apparently taken place on the titanium surface. …
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