Semiconductor device having bonding pad above low-k dielectric film and manufacturing method therefor
作者： Yoshihisa Matsubara
DOI:
关键词:
摘要: A semiconductor device comprises, a protective element on substrate; low-k dielectric film opposite the and having mechanical strength smaller than silicon oxide film; mesh wiring in film, including power supply wirings ground arranged mesh, being electrically connected to element; bonding pad wiring.
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