Semiconductor device structure with active regions having different surface directions

作者: Meikei Ieong , Effendi Leobandung , Bruce B. Doris , Huilong Zhu , Oleg Gluschenkov

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摘要: Semiconductor structure and method to simultaneously achieve optimal stress type current flow for both nFET pFET devices, gates orientated in one direction, are disclosed. One embodiment of the includes bonding a first wafer having surface direction orientation atop second different direction; forming an opening through wafer; region coplanar with wafer, wherein has direction. The semiconductor device at least two active regions directions, each including plurality nFETs pFETs, gate electrode is such that pFETs substantially parallel other.

参考文章(6)
Jack Allan Mandelman, Edward Joseph Nowak, Brian John Machesney, Method of making contacted body silicon-on-insulator field effect transistor ,(1995)
Ichiro Mizushima, Yoshihiro Minami, Hajime Nagano, Hisato Oyamatsu, Takashi Yamada, Tsutomu Sato, Shinji Miyano, Shinichi Nitta, Osamu Fujii, Semiconductor device having one of patterned SOI and SON structure ,(2002)
Robert C. Bowen, Yuguo Wang, Enhanced PMOS via transverse stress ,(2004)
Bethann Rainey, Edward J. Nowak, Dense dual-plane devices ,(2003)
Panayotis C. Andricacos, Wilma Jean Horkans, Keith T. Kwietniak, Dean S. Chung, Erick G. Walton, Soon-Cheon Seo, Steven H. Boettcher, Andrew H. Simon, Hariklia Deligianni, James E. Fluegel, Christopher C. Parks, Peter S. Locke, Electroplated copper interconnection structure, process for making and electroplating bath ,(2004)