3D via capacitor with a floating conductive plate for improved reliability
作者： Chih-Chao Yang , Baozhen Li , Fen Chen
DOI:
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摘要: The present invention provides a 3D via capacitor and method for forming the same. includes an insulating layer on substrate. has having sidewalls bottom. A first electrode overlies at least portion of bottom via. high-k dielectric material electrode. conductive plate is over layer. second leaves remaining unfilled. formed in substantially parallel to not contact with electrodes. An array such capacitors also provided.
google.ca 参考文章(18)
James W. Adkisson, John A. Bracchitta, Anthony K. Stamper, Jed H. Rankin, Polysilicon capacitor having large capacitance and low resistance and process for forming the capacitor ,(1999)
George Pelzman, Robert F. Mcclanahan, Andrew A. Shapiro, Hal D. Smith, Via capacitors within multi-layer 3-dimensional structures/substrates ,(1991)
Kevin John Fischer, Embedded capacitor device and methods of fabrication ,(2009)
C. Michael Garner, Kishore K. Chakravorty, Thomas S. Dory, Self-aligned coaxial via capacitors ,(1999)
David E. Kotecki, Jeffrey P. Gambino, Crown capacitor using a tapered etch of a damascene lower electrode ,(1997)
Eric Luckowski, Douglas R. Roberts, Process for making a mim capacitor ,(2002)
Boung Ju Lee, Heon Jong Shin, Hee Sung Kang, Methods of Forming Dual-Damascene Metal Wiring Patterns for Integrated Circuit Devices and Wiring Patterns Formed Thereby ,(2009)
Brent Gilgen, Belford T. Coursey, Capacitor for use in an integrated circuit ,(2004)
Xian J. Ning, Keith Kwong Hon Wong, Mim capacitor structures and fabrication methods in dual-damascene structures ,(2003)
Andreas Stich, Guenther Schindler, Michael Schrenk, Manfred Engelhardt, Mim capacitor and associated production method ,(2006)