Method of making a semiconductor device by forming a masking layer with a tapered etch profile

作者: Chih-I Wu , Jihperng Leu , Hyun-Mog Park

DOI:

关键词:

摘要: A method for making a semiconductor device is described. That includes forming sacrificial layer on substrate, then of photoresist the layer. After patterned, to form patterned that has first opening, part removed generate an etched second opening substantially smaller than opening.

参考文章(11)
Tri-Rung Yew, Yimin Huang, Method of patterning dielectric 專利權人:United Microelectronics Corp., Hsinchu, Taiwan. ,(1998)
Bhanwar Singh, Angela T. Hui, Method of creating a smaller contact using hard mask ,(2001)
Marina Plat, Christopher F. Lyons, Bhanwar Singh, Ramkumar Subramanian, Y-gate formation using damascene processing ,(2000)