Dishing-free gap-filling with multiple CMPs
作者： Ming-Yuan Wu , Mong-Song Liang , Chiung-Han Yeh , Kong-Beng Thei , Harry-Hak-Lay Chuang
DOI:
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摘要: A method of forming an integrated circuit structure includes providing a semiconductor substrate; patterned features over the substrate, wherein gaps are formed between features; filling with first material, material has top surface higher than surfaces and performing planarization to lower until exposed. The further depositing second
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