Substrate processing apparatus and substrate processing method drying substrate by spraying gas

作者: Akira Izumi

DOI:

关键词:

摘要: A first gas nozzle and a second are fixedly provided in the vicinity of forward end arm. The arm is rotated along locus R while substrate rinsed with deionized water rotated, for discharging nitrogen from nozzles. Visible moisture loosely expelled upper surface by spraying nozzle, slightly remaining on fine pattern or like can also be completely removed to same region as that sprayed nozzle. Consequently, stably reliably dried. Thus, processing apparatus capable drying provided.

参考文章(9)
Piero Sferlazzo, Peter H. Rose, Processing a surface ,(1994)
Steven Verhaverbeke, Eugene Smargiassi, Brian H. Burrows, Ho-Man Rodney Chiu, Gutter and splash-guard for protecting a wafer during transfer from a single wafer cleaning chamber ,(2002)
Steven Verhaverbeke, Rick Endo, Alexander Ko, J. Truman, Method and apparatus for wafer cleaning ,(2006)
Sadao Hirae, Shuichi Yasuda, Masanobu Sato, Kenya Morinishi, Substrate cleaning apparatus ,(2001)
Marc Heyns, Paul Mertens, Marc Meuris, Method and apparatus for removing a liquid from a surface ,(1998)
Kiyohisa Tateyama, Kimio Motoda, Tsutae Omori, Kenji Sekiguchi, Method of forming a coating film and coating apparatus ,(1996)
ポウル・メルテンス, マルク・メーリス, マルク・ヘインス, Paul Mertens, Mark Meuris, Marc Heyns, Method and apparatus for removing a liquid from rotating substrate surface ,(1998)
都 山坂, Miyako Yamasaka, Liquid processing method and device therefor ,(1997)
Yoshitani Mitsuaki, SUBSTRATE-DRYING DEVICE ,(1999)