Stacked-die image sensors with shielding
作者： Raminda Madurawe , Richard Mauritzson
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摘要: A stacked-die image sensor may be provided with an array of pixels. The include at least first and second integrated circuit dies stacked on top one another. Some the pixel circuitry in each formed die some die. Coupling structures such as conductive pads electrically couple to shielding structure partially or completely surround pad reduce parasitic capacitive coupling between adjacent pads. a metal wire coupled ground voltage. extend columns pixels and/or rows
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