作者: Kuo-Shen Chen , Xin Zhang , Shih-Yuan Lin
DOI: 10.1016/S0040-6090(03)00462-0
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摘要: This paper discusses thermo-mechanical behavior of plasma-enhanced chemical vapor deposited oxide films during and after post-deposition thermal cycling annealing. A series experiments were conducted with various types nitride to elucidate the control mechanism intrinsic stress generation develop engineering solutions for improving reliability microelectromechanical system fabrication processes. Tensile was observed depletion hydrogen shrinkage micro voids existing in postulated as a major modeled by an energy-based formulation. Subsequent indicated that annealing at high temperature could reduce this tensile stress. Both relaxation guide development maintain structural integrity improve performance.