Intrinsic stress generation and relaxation of plasma-enhanced chemical vapor deposited oxide during deposition and subsequent thermal cycling

作者: Kuo-Shen Chen , Xin Zhang , Shih-Yuan Lin

DOI: 10.1016/S0040-6090(03)00462-0

关键词:

摘要: This paper discusses thermo-mechanical behavior of plasma-enhanced chemical vapor deposited oxide films during and after post-deposition thermal cycling annealing. A series experiments were conducted with various types nitride to elucidate the control mechanism intrinsic stress generation develop engineering solutions for improving reliability microelectromechanical system fabrication processes. Tensile was observed depletion hydrogen shrinkage micro voids existing in postulated as a major modeled by an energy-based formulation. Subsequent indicated that annealing at high temperature could reduce this tensile stress. Both relaxation guide development maintain structural integrity improve performance.

参考文章(18)
Ivan Fanderlik, Silica glass and its application Elsevier. ,(1991)
Henry Windischmann, Intrinsic stress in sputter-deposited thin films Critical Reviews in Solid State and Materials Sciences. ,vol. 17, pp. 547- 596 ,(1992) , 10.1080/10408439208244586
H. ‐J. Schliwinski, U. Schnakenberg, W. Windbracke, H. Neff, P. Lange, Thermal Annealing Effects on the Mechanical Properties of Plasma‐Enhanced Chemical Vapor Deposited Silicon Oxide Films Journal of The Electrochemical Society. ,vol. 139, pp. 1730- 1735 ,(1992) , 10.1149/1.2069484
Jon K West, John J Mecholsky, Larry L Hench, The application of fractal and quantum geometry to brittle fracture Journal of Non-crystalline Solids. ,vol. 260, pp. 99- 108 ,(1999) , 10.1016/S0022-3093(99)00566-9
H. Windischmann, R.W. Collins, J.M. Cavese, Effect of hydrogen on the intrinsic stress in ion beam sputtered amorphous silicon films Journal of Non-crystalline Solids. ,vol. 85, pp. 261- 272 ,(1986) , 10.1016/0022-3093(86)90001-3
Eugene A. Olevsky, Theory of sintering: from discrete to continuum Materials Science & Engineering R-reports. ,vol. 23, pp. 41- 100 ,(1998) , 10.1016/S0927-796X(98)00009-6
Xin Zhang, K-S Chen, R Ghodssi, AA Ayon, S Mark Spearing, Residual stress and fracture in thick tetraethylorthosilicate (TEOS) and silane-based PECVD oxide films Sensors and Actuators A-physical. ,vol. 91, pp. 373- 380 ,(2001) , 10.1016/S0924-4247(01)00610-0
P. Chaudhari, Grain Growth and Stress Relief in Thin Films Journal of Vacuum Science and Technology. ,vol. 9, pp. 520- 522 ,(1972) , 10.1116/1.1316674
Mary F. Doerner, William D. Nix, Stresses and deformation processes in thin films on substrates Critical Reviews in Solid State and Materials Sciences. ,vol. 14, pp. 225- 268 ,(1988) , 10.1080/10408438808243734