作者: Muthu B. J. Wijesundara , Robert G. Azevedo
DOI: 10.1007/978-1-4419-7121-0_2
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摘要: This chapter contains a broad review of SiC materials and processing technology necessary to create electronics, micromechanical transducers, packaging. Details on deposition etching methods are covered. The material properties various forms (single crystalline, polycrystalline, amorphous) along with their use for creating the components harsh environment microsystems will also be discussed. Current status future research highlighted regards both technologies.